Electronic device

ABSTRACT

An electronic device including a plurality of light-emitting units, a driving circuit, and a controlling circuit is provided. The driving circuit is configured to drive at least one of the light-emitting units. The controlling circuit is configured to control the driving circuit. The plurality of light-emitting units, the driving circuit, and the controlling circuit are respectively disposed on different substrates.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of U.S. provisionalapplication Ser. No. 62/976,361, filed on Feb. 14, 2020, and Chinaapplication serial no. 202011182961.0, filed on Oct. 29, 2020. Theentirety of each of the above-mentioned patent applications is herebyincorporated by reference herein and made a part of this specification.

BACKGROUND Technical Field

The disclosure relates to an electronic device.

Description of Related Art

Currently, electronic devices (e.g., display devices) on the market havedeveloped into maturity, but further efforts are still required forphenomena such as reducing costs, increasing energy conversionefficiency of electronic elements, facilitating wiring design, andreducing damage during transportation, etc.

SUMMARY

The present disclosure provides an electronic device, which facilitatesan improvement in at least one of the above-mentioned phenomena.

According to the embodiment of the disclosure, the electronic deviceincludes a plurality of light-emitting units, a driving circuit, and acontrolling circuit. The driving circuit is configured to drive at leastone light-emitting unit in the plurality of light-emitting units. Thecontrolling circuit is configured to control the driving circuit. Theplurality of light-emitting units, the driving circuit, and thecontrolling circuit are respectively disposed on different substrates.

To make the aforementioned more comprehensible, several embodimentsaccompanied with drawings are described in detail as follows.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the disclosure, and are incorporated in and constitutea part of this specification. The drawings illustrate exemplaryembodiments of the disclosure and, together with the description, serveto explain the principles of the disclosure.

FIG. 1 is a schematic partial cross-sectional view of an electronicdevice according to an embodiment according to the disclosure.

FIG. 2 is a circuit diagram of the driving circuit and the controllingcircuit in FIG. 1.

FIG. 3 is a schematic partial view of a back surface of the electronicdevice in FIG. 1.

FIG. 4 to FIG. 8 are respectively schematic partial cross-sectionalviews of electronic devices according to other embodiments of thedisclosure.

DESCRIPTION OF THE EMBODIMENTS

The disclosure may be understood with reference to the followingdetailed description and the accompanying drawings. It should be notedthat, for ease of understanding by readers and conciseness of thedrawings, the plurality of drawings in the disclosure merely show a partof an electronic device/display device, and specific elements in thedrawings are not drawn to scale. Besides, the number and size of eachelement in the drawings only serve for exemplifying, instead of definingor limiting the scope of the disclosure. For example, a relativedimension, thickness, and position of each film layer, region, orstructure may be reduced or enlarged for the sake of clarity.

Some terms are used to refer to specific elements throughout the wholespecification and the appended claims in the disclosure. A personskilled in the art should understand that an electronic devicemanufacturer may use different names to refer to the same elements. Thisspecification is not intended to distinguish elements that have the samefunctions but different names. In this specification and the claims,terms such as “have”, “include”, and “comprise” are open-ended terms,and should be interpreted as “including, but not limited to”.

The directional terms mentioned herein, such as “above”, “below”,“front”, “back’, “left”, “right”, and the like, refer only to thedirections in the accompanying drawings. Therefore, the directionalterms are used for explaining instead of limiting the disclosure. Itshould be understood that when an element or film layer is referred toas being disposed “on”, or “connected to” another element or film layer,the element or film layer may be directly on or connected to saidanother element or film layer, or intervening elements or film layersmay also be present (non-direct circumstances). In contrast, when anelement or film layer is referred to as being “directly on” or “directlyconnected to” another element, no intervening elements or film layersare present.

The term “about”, “substantial”, or “essential” mentioned hereintypically represents a value is in a range within 10% of a given value,or a range within 5%, 3%, 2%, 1%, or 0.5% of a given value. In addition,the terms “the given range is from the first value to the second value”and “the given range falls within the range of the first value to thesecond value” indicate that the given range includes the first value,the second value, and other values in between.

In some embodiments of the disclosure, terms related to bonding andconnection such as “connect”, “interconnect”, etc., unless specificallydefined, may indicate the case where two structures are in directcontact, or where two structures are not in direct contact with otherstructures disposed in between. The terms related to bonding andconnection may also cover cases where two structures are both movable ortwo structures are both fixed. In addition, the term “electric connect”and “couple” include any direct and indirect electrical connectionmeans.

In the following embodiments, identical or similar reference numeralswill be used to refer to identical or similar elements, and repeateddescription thereof will be omitted. In addition, the features in thedifferent exemplary embodiments may be used in combination with eachother without departing from or conflicting with the spirit of thedisclosure, and simple equivalent variations and modifications made inaccordance with this specification or the claims are still within thescope of the disclosure. Moreover, “first”, “second”, and similar termsmentioned in the specification or the claims are merely used to namediscrete elements or to differentiate among different embodiments orranges. Therefore, the terms should not be regarded as limiting an upperlimit or a lower limit of the quantity of the elements and should not beused to limit the manufacturing sequence or arrangement sequence ofelements.

In the disclosure, the electronic device may include, but is not limitedto, a display device, an antenna device, a sensing device, alight-emitting device, or a tiled device. The electronic device may be abendable or flexible electronic device. The electronic device may, forexample, include a liquid crystal layer or a light-emitting diode. Thelight-emitting diode may include, but is not limited to, an organiclight-emitting diode (OLED), a mini light-emitting diode (mini LED), amicro light-emitting diode (micro LED), a quantum dot light-emittingdiode (quantum dot LED, which may include QLED and QDLED), afluorescence, a phosphor, or other suitable material or a combination ofthe above. Hereinafter, a display device will be adopted as theelectronic device to explain the content of the disclosure. Nonetheless,the disclosure is not limited thereto.

In the disclosure, the display device may be any type of display device,such as a self-luminous display device or a non-self-luminous displaydevice. The self-luminous display device may include, but is not limitedto, a light-emitting diode, a light conversion layer, or other suitablematerials or a combination of the above. The light-emitting diode mayinclude, but is not limited to, an organic light-emitting diode (OLED),a mini light-emitting diode (mini LED), a micro light-emitting diode(micro LED), a quantum dot light-emitting diode (quantum dot LED, whichmay include QLED and QDLED). The light conversion layer may include awavelength conversion material and/or a light filter material, and thelight conversion layer may include, but is not limited to, afluorescence, a phosphor, a quantum dot (QD), other suitable materials,or a combination of the above, for example. The non-self-luminousdisplay device may include, but is not limited to, a liquid crystaldisplay device. Hereinafter, a self-luminous display device will beadopted as the display device to explain the content of the disclosure.Nonetheless, the disclosure is not limited thereto. In some embodiments,the chip dimension of a light-emitting diode is about 300 μm to 10 mm(300 μm≤chip dimension≤10 mm), the chip dimension of a minilight-emitting diode is about 100 μm to 300 μm (100 μm≤chipdimension≤300 μm), and the chip dimension of a micro light-emittingdiode is about 1 μm to 100 μm (1 μm≤chip dimension≤100 μm). Nonetheless,the disclosure are not limited thereto.

FIG. 1 is a schematic partial cross-sectional view of an electronicdevice according to an embodiment according to the disclosure. Withreference to FIG. 1, an electronic device 1 includes a plurality oflight-emitting units 10, a driving circuit 11, and a controlling circuit12. The driving circuit 11 is configured to drive at least onelight-emitting unit 10 of the plurality of light-emitting units 10. Thecontrolling circuit 12 is configured to control the driving circuit 11.The plurality of light-emitting units 10, the driving circuit 11, andthe controlling circuit 12 are respectively disposed on differentsubstrates, and herein the substrates refer to the substrates configuredto be disposed with/carry/form the plurality of light-emitting units 10,the driving circuit 11, and the controlling circuit 12. As shown in FIG.1, the plurality of light-emitting units 10, the driving circuit 11, andthe controlling circuit 12 are, for example, disposed/formed on asubstrate 13, a substrate 14, and a substrate 15. The materials of thesubstrate 13, the substrate 14, and the substrate 15 may be selecteddepending on different requirements and considerations. For example, thematerials of the substrate 13, the substrate 14, and the substrate 15may include but are not limited to glass, plastic, a wafer, or acombination thereof.

To be specific, the plurality of light-emitting units 10 may include aplurality of light-emitting diode chips, a plurality of light-emittingdiode packages, or a combination thereof. FIG. 1 schematically showsthat the plurality of light-emitting units 10 include the plurality oflight-emitting diode packages 100, and the light-emitting diode packages100 are disposed on the substrate 13 and include three light-emittingdiode chips (e.g., a light-emitting diode chip 1000, a light-emittingdiode chip 1001, and a light-emitting diode chip 1002) and a protectivelayer 1003. It should be understood that the type of the plurality oflight-emitting units 10, the number of light-emitting diode chips in thelight-emitting unit 10, the number or type of film layers in thelight-emitting unit 10, the relative configuration relationship ordimensions (a length, a width, a thickness, etc.) of the elements/filmlayers in the light-emitting unit 10, or the like may be changeddepending on requirements, and the disclosure is not limited to thoseshown in FIG. 1.

The three light-emitting diode chips may, for example, emit light ofdifferent colors. For example, the light-emitting diode chip 1000, thelight-emitting diode chip 1001, and the light-emitting diode chip 1002may respectively be a red light-emitting diode chip, a greenlight-emitting diode chip, and a blue light-emitting diode chip, but thedisclosure is not limited thereto. The protective layer 1003 covers thethree light-emitting diode chips and the substrate 13. The material ofthe protective layer 1003 may include, but is not limited to, atransparent material, a water vapor and oxygen barrier material, othersuitable materials, or a combination of the above. For example, thematerial of the protective layer 1003 may include, but is not limitedto, epoxy, an acrylic-based resin, silicone, a polyimide polymer, or acombination of the above.

The plurality of light-emitting units 10 may be arranged into an array.For example, the plurality of light-emitting units 10 may be arrangedinto a two-dimensional matrix along a first direction D1 and a seconddirection D2. The first direction D1 and the second direction D2intersect each other and are each perpendicular to a thickness direction(e.g., a third direction D3) of the electronic device 1. FIG. 1schematically shows that the first direction D1 and the second directionD2 are perpendicular to each other, but the disclosure is not limitedthereto. In some embodiments, it is not required that the firstdirection D1 and the second direction D2 intersect at an angleperpendicular to each other.

In some embodiments, the electronic device 1 may also include a circuitboard 16. The circuit board 16 may include a thin film, a board, or acombination of the above having a wiring line. For example, the circuitboard 16 may include, but is not limited to, a printed circuit board(PCB) or a flexible printed circuit board (FPCB).

The plurality of light-emitting units 10, the driving circuit 11, andthe controlling circuit 12 may be disposed on the circuit board 16through bonding in any known form, and the respective forms in which thethree are bonded to the circuit board 16 may be the same or different.FIG. 1 schematically shows that the plurality of light-emitting units 10are electrically connected to the circuit board 16 through a pluralityof conductive bumps 17 (e.g., solders), and the driving circuit 11 andthe controlling circuit 12 are electrically connected to the circuitboard 16 through a connecting member 18 (e.g., a flexible flat cable ora flexible printed circuit board), but the disclosure is not limitedthereto. In other embodiments, any one of the driving circuit 11 and thecontrolling circuit 12 may also be electrically connected to the circuitboard 16 through a conductive bump 17. Besides, depending on differentdesigns, the substrate 14 may be located between the driving circuit 11and the circuit board 16, or the driving circuit 11 may be locatedbetween the substrate 14 and the circuit board 16. Similarly, thesubstrate 15 may be located between the controlling circuit 12 and thecircuit board 16, or the controlling circuit 12 may be located betweenthe substrate 15 and the circuit board 16.

FIG. 2 is a circuit diagram of the driving circuit and the controllingcircuit in FIG. 1. FIG. 3 is a schematic partial view of a back surfaceof the electronic device in FIG. 1. With reference to FIG. 1 to FIG. 3,the driving circuit 11 may be electrically connected to at least onelight-emitting unit 10 through the circuit board 16. For example, thedriving circuit 11 may be electrically connected to the at least onelight-emitting unit 10 through a conductive via 160 (shown in FIG. 1 andFIG. 3) in the circuit board 16, but is not limited thereto.Alternatively, the driving circuit 11 may be electrically connected tothe at least one light-emitting unit 10 through an interconnectstructure in the circuit board 16 (including such as a plurality of viasand a plurality of metal layers). On the other hand, the controllingcircuit 12 may be electrically connected to the driving circuit 11through the circuit board 16. For example, the controlling circuit 12may be electrically connected to the driving circuit 11 through a wiringline 162 (shown in FIG. 3) on the circuit board 16, but is not limitedthereto.

In some embodiments, the driving circuit 11 may include a drivingtransistor 110 configured to drive the at least one light-emitting unit10, and the controlling circuit 12 may include a controlling transistor120 configured to control the driving transistor 110. As shown in FIG. 2and FIG. 3, the driving circuit 11 may be an integrated circuit (IC) ora chip including a plurality of driving transistors 110. On the otherhand, the controlling circuit 12 may also be an integrated circuit or achip including a plurality of controlling transistors 120.

To be specific, the plurality of driving transistors 110 and otherelements (e.g., a light-emitting signal generator 112, a plurality ofsignal lines 114, a light-emitting signal controlling transistor 116,etc.) may be formed on the substrate 14. Then, a plurality of drivingcircuits 11 are formed through a packaging process and a singulationprocess (e.g., a cutting process). Each driving circuit 11 may includethe plurality of driving transistors 110 and other elements (e.g., thelight-emitting signal generator 112, the plurality of signal lines 114,the light-emitting signal controlling transistor 116, etc.) Similarly,the plurality of controlling transistors 120 and other elements (e.g., ascan signal generator 122, a plurality of scan lines 124, a plurality ofdata lines 126, etc.) may be formed on the substrate 15. Then, aplurality of controlling circuits 12 are formed through a packagingprocess and a singulation process. Each controlling circuit 12 mayinclude the plurality of controlling transistors 120 and other elements(e.g., the scan signal generator 122, the plurality of scan lines 124,the plurality of data lines 126, etc.) In some embodiments, thecontrolling circuit 12 may also include, but is not limited to, a biascompensation element (not shown), a capacitor (not shown), or acombination thereof. Therein, the bias compensation element (not shown)may be an element that compensates for the bias of the thresholdvoltage.

In some embodiments, an extension direction of the plurality of datalines 126 may be substantially parallel to the first direction D1, andan extension direction of the plurality of scan lines 124 may besubstantially parallel to the second direction D2, but the disclosure isnot limited thereto.

As shown in FIG. 2, the controlling circuit 12 (e.g., the controllingtransistor 120) may receive signals from the scan line 124 and the dataline 126. The driving transistor 110 of the driving circuit 11 iselectrically connected between a signal terminal VDD and thelight-emitting signal controlling transistor 116, the light-emittingsignal controlling transistor 116 is electrically connected between thedriving transistor 110 and the light-emitting unit 10, and thelight-emitting unit 10 is electrically connected between thelight-emitting signal controlling transistor 116 and a signal terminalVSS.

As shown in FIG. 3, the signal from the circuit board 16 may betransmitted through a connecting layer F1 to a chip C1. The connectinglayer F1 may be a substrate having a wiring line, and the chip C1 may bea chip-on-glass (COG) package or a chip-on-flex (COF) package, but thedisclosure is not limited thereto. The chip C1 may transmit a signal tothe driving transistor 110 and the light-emitting signal controllingtransistor 116 of the driving circuit 11, and the signal transmitted tothe light-emitting signal controlling transistor 116 may be transmittedthrough the conductive via 160 to the corresponding light-emitting unit10 to drive the corresponding light-emitting unit 10. On the other hand,the signal from the circuit board 16 may be transmitted to a chip C2 viaa connecting layer F2. For the types of the connecting layer F2 and thechip C2, reference may be made to the connecting layer F1 and the chipC1, and will not be repeated herein. The chip C2 may transmit a signalthrough the scan line 124, the data line 126, and the scan signalgenerator 122 to the controlling transistor 120 of the controllingcircuit 12, and transmit a signal through the wiring line 162 to thedriving transistor 110 of the driving circuit 11. It should beunderstood that design parameters such as the number, the dimension, orthe arrangement of each of the elements (e.g., the transistors or otherwiring lines) in the driving circuit 11 or the controlling circuit 12may be changed depending on requirements, and are not limited to thoseshown in FIG. 3.

With reference to FIG. 1 again, the plurality of light-emitting units 10may be disposed on a front surface SF of the circuit board 16 to providelight beams. On the other hand, the driving circuit 11 and thecontrolling circuit 12 may be disposed on a back surface SB of thecircuit board 16 to reduce the influence of the driving circuit 11 andthe controlling circuit 12 on the visual effect or reduce the visibilityof the driving circuit 11 and the controlling circuit 12. In someembodiments, each light-emitting unit 10 may be controlled by one ormore driving circuits 11 and one or more controlling circuits 12. Inother embodiments, each driving circuit 11 and the correspondingcontrolling circuit 12 may control one or more light-emitting units 10.The respective quantities of the light-emitting units 10, the drivingcircuit 11, and the controlling circuit 12 in the electronic device 1may be changed depending on requirements and are not limited herein.

Since the plurality of driving transistors 110 and the plurality ofcontrolling transistors 120 are respectively fabricated on differentsubstrates (e.g., the substrate 14 and the substrate 15) and then bondedto the circuit board 16, the driving transistor 110 and the controllingtransistor 120 may therefore respectively have channels comprisingdifferent materials. For example, a channel of the driving transistor110, which requires the generation of a large current to control thelight-emitting unit 10, may have an electron mobility greater than anelectron mobility of a channel of the controlling transistor 120. Inthis way, an IR drop caused by a large cross-voltage of the drivingtransistor 110 may be alleviated, facilitating an increase in the energyconversion efficiency. For example, the material of the channel of thedriving transistor 110 may include monocrystalline silicon, and thematerial of the channel of the controlling transistor 120 may includepolycrystalline silicon, amorphous silicon, or metal oxide, but thedisclosure is not limited thereto. In some embodiments, based on theconsideration of costs or reliability, the driving transistor 110 andthe light-emitting signal controlling transistor 116 may also be ametal-oxide-semiconductor field-effect transistor (MOSFET), a bipolarjunction transistor (BJT), an indium gallium zinc oxide thin filmtransistor (IGZO TFT), an organic thin film transistor (OTFT), or amicrocrystalline silicon thin film transistor (μ-Si TFT).

The design in which the plurality of driving transistors 110 areintegrated into a chip (integration) facilitates reduction in the damageresulting from impact or collision by an external force duringtransportation or movement, thereby facilitating an increase in a yieldrate or cost reduction. Besides, the plurality of driving transistors110 are disposed on the circuit board 16 in the form of chips, thereforefacilitating an increase in the utilization rate of the wiring space,convenience in the wiring, or an increase in the flexibility of thewiring design. In addition, the convenience in repair and replacementfacilitates an increase in a yield rate or cost reduction. Furthermore,the wiring line in the circuit board 16 may comprise copper or othermaterials having a low-resistivity, therefore facilitating reduction inthe generation of heat sources or cost reduction.

Depending on different requirements, the electronic device 1 may alsoinclude other elements. For example, the electronic device 1 may alsoinclude an element 19. The element 19 may include a chip, a resistor, acapacitor, or other elements, and is not specifically limited herein. Inany embodiment of the disclosure, the same change may be made and willnot be repeatedly described hereinafter.

FIG. 4 to FIG. 8 are respectively schematic partial cross-sectionalviews of electronic devices according to other embodiments of thedisclosure. With reference to FIG. 4, an electronic device 2 includes aplurality of light-emitting units 20, a plurality of driving circuits21, a plurality of controlling circuits 22, a plurality of substrates13, a plurality of substrates 14, a plurality of substrates 15, thecircuit board 16, a polyimide layer 23, and an optical film 24.

The plurality of light-emitting units 20 are disposed on the pluralityof substrates 13, and the plurality of substrates 13 may be electricallyconnected to the circuit board 16 through the plurality of conductivebumps 17. The plurality of light-emitting units 20 may include aplurality of light-emitting diode chips 200. In addition, the materialof the substrate 13 may be selected from glass, but is not limitedthereto. Depending on different applications (e.g., serving as abacklight of a non-self-luminous display or as a self-luminous display),the plurality of light-emitting diode chips 200 may emit light of thesame or different colors. In some embodiments, the light-emitting unit20 may also include, but is not limited to, a light conversion layer, acolor filter layer, or other suitable materials or a combination of theabove.

The plurality of driving circuits 21 are disposed on the plurality ofsubstrates 14. The plurality of driving circuits 21 are located betweenthe circuit board 16 and the plurality of substrates 14. The pluralityof driving circuits 21 may be electrically connected to the circuitboard 16 through the plurality of conductive bumps 17. The material ofthe substrate 14 may include, but is not limited to, a wafer.

In this embodiment, it is possible that the driving transistor 110 andthe light-emitting signal controlling transistor 116 of the drivingcircuit 21 are not integrated into an integrated circuit. As shown inFIG. 4, the driving transistor 110 and the light-emitting signalcontrolling transistor 116 may be respectively disposed on differentsubstrates 14 and then electrically connected to the circuit board 16through the plurality of conductive bumps 17. In this way, the volume ofeach individual (e.g., the driving transistor 110 and the substrate 14,or the light-emitting signal controlling transistor 116 and thesubstrate 14) in the driving circuit 21 may be decreased or thevisibility of each individual may be reduced. Under this architecture,the driving circuit 21 may be disposed on the front surface SF of thecircuit board 16 in addition to the back surface SB of the circuit board16.

The plurality of controlling circuits 22 are disposed on the pluralityof substrates 15. The plurality of controlling circuits 22 are locatedbetween the circuit board 16 and the plurality of substrates 15. Theplurality of controlling circuits 22 may be electrically connected tothe circuit board 16 through the plurality of conductive bumps 17. Inthis embodiment, the number of controlling transistor 150 in eachcontrolling circuit 22 may be one, and the one transistor may bedisposed on the substrate 15 and then electrically connected to thecircuit board 16 through the plurality of conductive bumps 17. In otherwords, it is also possible that the controlling circuit 22 is notintegrated into an integrated circuit. In this way, the volume of eachindividual (e.g., the controlling transistor 150 and the substrate 15)in the controlling circuit 22 may be decreased or the visibility of eachindividual may be reduced. Under this architecture, the controllingcircuit 22 may be disposed on the front surface SF of the circuit board16 in addition to the back surface SB of the circuit board 16.

In some embodiments, the plurality of light-emitting units 20, thedriving circuit 21, and the controlling circuit 22 may all be disposedon the front surface SF of the circuit board 16, reducing the steps anddifficulty of the manufacturing process.

In the embodiment of FIG. 4, the electronic device 2 may include aplurality of minimum units U. The plurality of minimum units U may bearranged along the first direction D1 and the second direction D2. Theminimum unit U may include a light-emitting unit 20, a driving circuit21, and a controlling circuit 22, and each light-emitting unit 20 iscontrolled by a driving circuit 21 and a controlling circuit 22. Inother embodiments, each light-emitting unit 20 may be controlled by aplurality of driving circuits 21 and a plurality of controlling circuits22. Alternatively, a plurality of light-emitting units 20 may becontrolled by one driving circuit 21 and one controlling circuit 22.

The polyimide layer 23 is disposed between the plurality of controllingcircuits 22 and the substrate 15 on which the plurality of controllingcircuits 22 are disposed. The hardness of the plurality of substrates 15may be greater than the hardness of the polyimide layer 23. For example,the material of the plurality of substrates 15 may include, but is notlimited to, glass. By disposing the plurality of substrates 15, not onlythe plurality of controlling circuits 22 may be protected, butsupportability may also be provided so that the plurality of controllingcircuits 22 may be formed on the polyimide layer 23. In addition, sincethe polyimide layer 23 is relatively soft, the polyimide layer 23 mayserve as a buffer between the plurality of substrates 15 and theplurality of controlling circuits 22, alleviating in cracking of theplurality of substrates 15 due to thermal expansion and contraction. Inother embodiments, it is possible that the electronic device 2 does notinclude the polyimide layer 23.

The optical film 24 may be a light reflecting layer. In this embodiment,the optical film 24 is disposed on the front surface SF of the circuitboard 16 and located in a region on which the plurality of theconductive bumps 17 are not disposed. The optical film 24 (e.g., a lightreflecting layer) may be configured to reflect light to increase thelight utilization rate. For example, the material of the optical film 24may include, but is not limited to, a white adhesive, paint, or tape. InFIG. 4, the optical film 24 includes a portion (e.g., a portion 24-1 toa portion 24-4) overlapping the light-emitting unit 20, the controllingcircuit 22, the driving transistor 110, and the light-emitting signalcontrolling transistor 116 in the third direction D3. In otherembodiments, it is possible that the optical film 24 does not includethe portion (e.g., the portion 24-1 to the portion 24-4) overlapping thelight-emitting unit 20, the controlling circuit 22, the drivingtransistor 110, and the light-emitting signal controlling transistor 116in the third direction D3. In still other embodiments, the optical film24 may further cover elements (e.g., the substrate 15 and the substrate14) other than the plurality of light-emitting units 20. In thefollowing embodiments of the disclosure, the same change may be made andwill not be repeatedly described hereinafter.

In some embodiments, the optical film 24 may be a light absorbing layerand is configured to absorb light, increasing the contrast. Notably, thelight absorbed by the light absorbing layer is light that interfereswith or affects the quality of light emitted by the light-emitting unit.Besides, in some embodiments, the optical film 24 may selectivelydispose a light reflecting layer in some regions and dispose a lightabsorbing layer in some other regions, depending on the optical designof the electronic device. Nonetheless, the disclosure is not limitedthereto.

With reference to FIG. 5, in an electronic device 3, the controllingcircuit 22, the polyimide layer 23, and the substrate 15 are disposed onthe back surface SB of the circuit board 16, and the controlling circuit22 is electrically connected to the circuit board 16 through theplurality of conductive bumps 17. In this way, the pitch between twoadjacent minimum units U (referring to FIG. 4) may be reduced,facilitating an increase in the density of the lit area, and furtherfacilitating an increase in the resolution of the electronic device 3.

With reference to FIG. 6, in an electronic device 4, the driving circuit21 and the substrate 14 are disposed on the back surface SB of thecircuit board 16, and the driving circuit 21 is electrically connectedto the circuit board 16 through the plurality of conductive bumps 17. Inthis way, the pitch between two adjacent minimum units U (referring toFIG. 4) may be reduced, facilitating an increase in the density of thelit area, and further facilitating an increase in the resolution of theelectronic device 4.

With reference to FIG. 7, in an electronic device 5, the drivingtransistor 110 of the driving circuit 21, the substrate 14, thelight-emitting unit 20, and the substrate 13 are disposed on the backsurface SB of the circuit board 16, and the driving transistor 110 andthe light-emitting unit 20 are electrically connected to the circuitboard 16 through the plurality of conductive bumps 17. In this way, thepitch between two adjacent minimum units U (referring to FIG. 4) may bereduced, facilitating an increase in the density of the lit area, andfurther facilitating an increase in the resolution of the electronicdevice 5.

It should be understood that the light-emitting unit 20, the drivingcircuit 21, and the controlling circuit 22 may each be disposed on thefront surface SF or the back surface SB of the circuit board 16. Inaddition, the protection scope of the disclosure includes anycombination of the above-mentioned three configurations, and is notlimited to those shown in FIG. 4 to FIG. 7.

In the embodiment of FIG. 4 to FIG. 7, the light-emitting unit 20, thedriving circuit 21, and the controlling circuit 22 are electricallyconnected to the circuit board 16 through the plurality of conductivebumps 17, but the electrical connection between the three elements andthe circuit board 16 is not limited thereto. For example, the threeelements may also be electrically connected to the circuit board 16through an anisotropic conductive film (ACF), but is not limitedthereto. As shown in FIG. 8, in an electronic device 6, the element 60may be disposed on the front surface SF of the circuit board 16 throughan adhesive member (not shown, such as an adhesive, tape, or the like).Alternatively, although not shown, the element 60 may also be disposedon the back surface SB of the circuit board 16 through an adhesivemember. A conductor 62 covers a pad CP1 of the element 60 and a pad CP2of the circuit board 16. The pad CP1 of the element 60 may beelectrically connected to the pad CP2 of the circuit board 16 throughthe conductor 62. For example, the material of the pad CP1 and the padCP2 may include, but is not limited to, nickel and gold. The conductor62 may include tin, a conductive adhesive (of which the material may becopper or silver), or other suitable conductive materials.

In this embodiment, in addition to the pad CP1, the element 60 alsoincludes a polyimide substrate 600, a buffer layer 601, an active layer602, a gate isolating layer 603, a conductive layer 604, an isolatinglayer 605, an isolating layer 606, a conductive layer 607, an isolatinglayer 608, an isolating layer 609, an isolating layer 610, a conductivelayer 611, and an isolating layer 612. The buffer layer 601, the activelayer 602, the gate isolating layer 603, the conductive layer 604, theisolating layer 605, the isolating layer 606, the conductive layer 607,the isolating layer 608, the isolating layer 609, the isolating layer610, the conductive layer 611, the isolating layer 612, and the pad CP1are sequentially disposed on the circuit board 16. The conductive layer604 is a patterned conductive layer. For example, the conductive layer604 may include a gate 6030 disposed on a channel 6020 of the activelayer 602 and other elements (e.g., a signal line, etc.). The conductivelayer 607 is a patterned conductive layer. For example, the conductivelayer 607 may include a source 6070, a drain 6072, and other elements(e.g., a signal line, etc.) The source 6070 and the drain 6072 may beconnected to the channel 6020 of the active layer 602 respectively viathrough holes TH1 and TH2 penetrating the gate isolating layer 603, theisolating layer 605, and the isolating layer 606. The conductive layer611 is a patterned conductive layer. For example, the conductive layer611 may include an electrode 6110 and other elements. The electrode 6110may be connected to the drain 6072 via a through hole TH3 penetratingthe isolating layer 608, the isolating layer 609, and the isolatinglayer 610. The pad CP1 may be connected to the electrode 6110 through anaperture AP of the isolating layer 612.

It should be understood that the element 60 is merely schematic, and thenumber, type, dimension, relative configuration relationship, or otherdesign parameters of film layers in the element 60 may be changeddepending on requirements. Besides, the element 60 may be a transistorof the driving circuit 21, a transistor of the controlling circuit 22,an integrated circuit, the light-emitting unit 20, or the like in theforegoing embodiments.

For ease of description, FIG. 8 only shows one pad CP1 of the element 60and one pad CP2 of the circuit board 16. Nonetheless, the number of padCP1 of the element 60 and the number of pad CP2 of the circuit board 16may be changed depending on requirements. The lateral connection of thepad CP1 with the pad CP2 using the conductor 62 facilitates an increasein the consistency in impedance.

In summary of the foregoing, in the embodiment of the disclosure,through disposing the plurality of light-emitting units, the drivingcircuit, and the controlling circuit on different substrates, theselection of the material of the substrate on which the plurality oflight-emitting units are positioned is no longer limited by the thinfilm transistor manufacturing process, and the material of the substrateon which the plurality of light-emitting units are positioned may beselected depending on requirements (e.g., the fixing power of theplurality of light-emitting units, whether the through holemanufacturing process is facilitated, among other considerations).Similarly, the material of the substrate on which the driving circuitand the controlling circuit are positioned may also be selecteddepending on requirements. In addition, the driving transistor and thecontrolling transistor may respectively have channels comprisingdifferent materials. For example, the channel of the driving transistormay have an electron mobility greater than an electron mobility of thechannel of the controlling transistor. In this way, the IR drop causedby a large cross-voltage of the driving transistor may be alleviated,facilitating an increase in the energy conversion efficiency. In someembodiments, the design in which the plurality of driving transistorsare integrated into a chip (integration) facilitates reduction in thedamage resulting from impact or collision by an external force duringtransportation or movement, thereby facilitating an increase in a yieldrate or cost reduction. Besides, the plurality of driving transistorsare disposed on the circuit board in the form of chips, thereforefacilitating an increase in the utilization rate of the wiring space,convenience in the wiring, or an increase in the flexibility of thewiring design. In addition, the convenience in repair and replacementfacilitates an increase in a yield rate or cost reduction. Furthermore,the wiring line in the circuit board may comprise copper or othermaterials having a low-resistivity, therefore facilitating reduction inthe generation of heat sources or cost reduction. In some embodiment,the plurality of driving transistors may be respectively disposed on theplurality of substrates, and the plurality of controlling transistorsmay be respectively disposed on the plurality of substrates. Thelight-emitting unit, the driving circuit, and the controlling circuitmay be disposed on the front surface and the back surface of the circuitboard to reduce the pitch between two adjacent minimum units,facilitating an increase in the density of the lit area, and furtherfacilitating an increase in the resolution of the electronic device. Insome embodiments, lateral connection of the pad of at least one of thelight-emitting unit, the driving circuit, and the controlling circuitwith the pad of the circuit board using the conductor facilitates anincrease in the consistency in impedance.

The foregoing embodiments are only used to explain, instead of limiting,the technical solutions of the disclosure. Although the disclosure hasbeen described in detail with reference to the foregoing embodiments,people having ordinary skill in the art should understand that thetechnical solutions described in the foregoing embodiments may still bemodified, or that some or all technical features therein may beequivalently replaced. However, the nature of the correspondingtechnical solutions so modified or replaced does not depart from thescope of the technical solutions of the embodiments of the disclosure.

Although the embodiments and the advantages thereof have been disclosedas above, it should be understood that people having ordinary skill inthe art may make combinations, variations, replacements, andmodifications without departing from the spirit and scope of thedisclosure, and the feature in each embodiment may be arbitrarily mixedwith and replaced by each other to form another new embodiment. Inaddition, the protection scope of the disclosure is not limited to aprocess, machine, manufacturing, material composition, device, method,and step in a specific embodiment in this specification. People havingordinary skill in the art may understand that the existing orto-be-developed process, machine, manufacturing, material composition,device, method, and step from the content of the disclosure may be usedaccording to the disclosure as long as the substantially same functioncan be implemented or the substantially same result can be obtained inthe embodiments described herein. Therefore, the protection scope of thedisclosure includes the foregoing process, machine, manufacturing,material composition, device, method, and step. In addition, each claimforms an independent embodiment, and the protection scope of thedisclosure also includes a combination of each of the claims andembodiments. The protection scope of the disclosure should be subject tothe appended claims.

What is claimed is:
 1. An electronic device, comprising: a plurality oflight-emitting units; a driving circuit configured to drive at least onelight-emitting unit of the plurality of light-emitting units; and acontrolling circuit configured to control the driving circuit; whereinthe plurality of light-emitting units, the driving circuit, and thecontrolling circuit are respectively disposed on different substrates.2. The electronic device according to claim 1, wherein the drivingcircuit is electrically connected to the at least one light-emittingunit through a circuit board, and the controlling circuit iselectrically connected to the driving circuit through the circuit board.3. The electronic device according to claim 1, wherein the drivingcircuit comprises a driving transistor configured to drive the at leastone light-emitting unit, and the controlling circuit comprises acontrolling transistor configured to control the driving transistor. 4.The electronic device according to claim 3, wherein the drivingtransistor and the controlling transistor respectively have channelscomprising different materials.
 5. The electronic device according toclaim 4, wherein the material of the channel of the driving transistorcomprises monocrystalline silicon.
 6. The electronic device according toclaim 4, wherein the material of the channel of the controllingtransistor comprises polycrystalline silicon.
 7. The electronic deviceaccording to claim 4, wherein the channel of the driving transistor hasan electron mobility greater than an electron mobility of the channel ofthe controlling transistor.
 8. The electronic device according to claim1, further comprising: a polyimide layer disposed between thecontrolling circuit and the substrate on which the controlling circuitis disposed.
 9. The electronic device according to claim 1, wherein theplurality of light-emitting units comprise a plurality of light-emittingdiode chips, a plurality of light-emitting diode packages, or acombination thereof.
 10. The electronic device according to claim 1,wherein the plurality of light-emitting units are arranged into anarray.
 11. The electronic device according to claim 1, wherein thesubstrate on which the plurality of light-emitting units are disposed isdisposed on a front surface of a circuit board, and the substrate onwhich the driving circuit is disposed and the substrate on which thecontrolling circuit is disposed are disposed on a back surface of thecircuit board.
 12. The electronic device according to claim 11, whereinthe driving circuit is electrically connected to the at least onelight-emitting unit through a conductive via in the circuit board. 13.The electronic device according to claim 1, wherein the differentsubstrates on which the plurality of light-emitting units, the drivingcircuit, and the controlling circuit are disposed are disposed on afront surface of a circuit board.
 14. The electronic device according toclaim 1, wherein the driving circuit comprises a driving transistor anda light-emitting signal controlling transistor, and the drivingtransistor and the light-emitting signal controlling transistor arerespectively disposed on different substrates.
 15. The electronic deviceaccording to claim 1, wherein the plurality of light-emitting units, thedriving circuit, and the controlling circuit are electrically connectedto a circuit board through a plurality of conductive bumps.
 16. Theelectronic device according to claim 15, further comprising: an opticalfilm disposed on a front surface of the circuit board and located in aregion on which the plurality of conductive bumps are not disposed. 17.The electronic device according to claim 16, wherein the optical filmfurther covers the substrate on which the driving circuit is disposedand the substrate on which the controlling circuit is disposed.
 18. Theelectronic device according to claim 16, wherein the optical film is alight reflecting layer.
 19. The electronic device according to claim 16,wherein the optical film is a light absorbing layer.
 20. The electronicdevice according to claim 1, wherein at least one of the differentsubstrates on which the plurality of light-emitting units, the drivingcircuit, and the controlling circuit are disposed is disposed on acircuit board through an adhesive member, and is electrically connectedto the circuit board through a conductor.